Manufacturing
Special custom packaging
10K & 100K class control clean room environment
IC wafer probe & tests
Wafer sawing
Die bonding from wafer rings and waffle packs
0.7 mil to 2.0 mil fine gold wire bonding
1 mil to 20 mil aluminium wire bonding
Polymer circuit printing
Plasma cleaning
Chip & wire and SMD packages
X-ray quality checks
Active/functional & ratio match laser trimming capabilities
Automatic pick & place component placement machines
Burn-in oven and reliability testers
Functional & circuit testers
Skilled operators, technicians, engineers and professional management
Special process know-how for all types of microcircuit packaging
